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Carbon Nanotubes for Interconnects: Process, Design and Applications
Todri-Sanial, Aida ; Dijon, Jean ; Maffucci, Antonio (Autor)
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Springer
· Tapa Blanda
Carbon Nanotubes for Interconnects: Process, Design and Applications - Todri-Sanial, Aida ; Dijon, Jean ; Maffucci, Antonio
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Reseña del libro "Carbon Nanotubes for Interconnects: Process, Design and Applications"
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.
